JPH089896Y2 - 電子装置のモールド部品 - Google Patents
電子装置のモールド部品Info
- Publication number
- JPH089896Y2 JPH089896Y2 JP1990112183U JP11218390U JPH089896Y2 JP H089896 Y2 JPH089896 Y2 JP H089896Y2 JP 1990112183 U JP1990112183 U JP 1990112183U JP 11218390 U JP11218390 U JP 11218390U JP H089896 Y2 JPH089896 Y2 JP H089896Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- molded
- solder
- electronic device
- electronic devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
Landscapes
- Pressure Sensors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112183U JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112183U JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0468371U JPH0468371U (en]) | 1992-06-17 |
| JPH089896Y2 true JPH089896Y2 (ja) | 1996-03-21 |
Family
ID=31859684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990112183U Expired - Lifetime JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH089896Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141473U (en]) * | 1979-03-29 | 1980-10-09 | ||
| JPH0665082B2 (ja) * | 1985-05-10 | 1994-08-22 | 株式会社日立製作所 | 回路基板の接続構造 |
-
1990
- 1990-10-25 JP JP1990112183U patent/JPH089896Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0468371U (en]) | 1992-06-17 |
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